The company “second-timer”, be Sematech again members of the Organization’s core

Last century 90 ‘s medium-term, TSMC company was announced not to participate in United States semiconductor manufacturing technology strategic alliance Sematech research and development plan of the Organization, but recently they have rejoined the Union,
The core members of the Union, after rejoined the Union, 20nm for TSMC will participate in the Union and a high level of process technology research and development plan. TSMC this “second-timer” the move shows the company has realized
They need to speed up the pace of research and development of process technology, along with whether Sematech research projects are ideal for TSMC needs of the organization.

To become core members of Sematech, to be paid to the Union than the ordinary members of the Organization, or temporary members participating in a research project a higher cost. The core members of the Organization are generally focused on difficult to research and development projects, such as EUV Lithography, III-V Group elements or germanium heterostructure channel material chips, and more difficult to project. The core members of the organization also needed for other research projects of the Union effort.

In addition to TSMC, Sematech’s other core members include GlobalFoundries, HP, IBM,Intel, UMC and the University of Albany College of Nanoscale Science and engineering (CNSE).

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Original: semimd

Tags: again, company, members, organizations, secondtimer, Sematech

Sematech Announces 6 companies to join its leading 3DIC chip stack technology startup projects

United States League of semiconductor manufacturing technology (Sematech) has announced and 6 semiconductor design/manufacturer to join the 3DIC chip stack technology startup projects (3D Enablement
Program), this list of 6 of the new company for the ASE (Advanced Semiconductor
Engineering）,Altera，ADI(Analog
Devices), LSI, On Semiconductor and Qualcomm.

December 2010, Sematech combined semiconductor Association (SIA) and the semiconductor research Association (SRC) started a new 3DIC chip stack technology startup projects, the project’s purpose is to promote the establishment of 3DIC technology standardization and the study of heterogeneous integration 3DIC technology. The primary objective of the project was to establish a set of key technologies such as measuring techniques of 3DIC chip bonding technology, micro-projection welding points (microbumping) and other related technical and specification standards.

Sematech announces completion of first last year 300mm 3DIC trial production line, the production-line built in the New York State University of science and
Albany nano-technology research center under the College of Engineering (CNSE), 3DIC chip stack technology and Sematech research is the Research Center for the core expanded. Before that, in addition to
Outside of the CNSE, have GlobalFoundries, HP, Hynix,IBM,Intel, Samsung and several UMC company joined the project.

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Original: semimd

Tags: Announces, companies, leading, projects, Sematech, stack, startup, Technology