Sematech Announces 6 companies to join its leading 3DIC chip stack technology startup projects

United States League of semiconductor manufacturing technology (Sematech) has announced and 6 semiconductor design/manufacturer to join the 3DIC chip stack technology startup projects (3D Enablement
Program), this list of 6 of the new company for the ASE (Advanced Semiconductor
Engineering）,Altera，ADI(Analog
Devices), LSI, On Semiconductor and Qualcomm.

December 2010, Sematech combined semiconductor Association (SIA) and the semiconductor research Association (SRC) started a new 3DIC chip stack technology startup projects, the project’s purpose is to promote the establishment of 3DIC technology standardization and the study of heterogeneous integration 3DIC technology. The primary objective of the project was to establish a set of key technologies such as measuring techniques of 3DIC chip bonding technology, micro-projection welding points (microbumping) and other related technical and specification standards.

Sematech announces completion of first last year 300mm 3DIC trial production line, the production-line built in the New York State University of science and
Albany nano-technology research center under the College of Engineering (CNSE), 3DIC chip stack technology and Sematech research is the Research Center for the core expanded. Before that, in addition to
Outside of the CNSE, have GlobalFoundries, HP, Hynix,IBM,Intel, Samsung and several UMC company joined the project.

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Original: semimd

Tags: Announces, companies, leading, projects, Sematech, stack, startup, Technology